The global wafer-level packaging market size reached US$ 4.0 Billion in 2021. Looking forward, IMARC Group expects the market to reach US$ 11.2 Billion by 2027, exhibiting a CAGR of 18.8% during 2022-2027.
Year Considered to Estimate the Market Size:
Base Year of the Analysis: 2021
Historical Period: 2016-2021
Forecast Period: 2022-2027
Wafer-level packaging (WLP) is a technological solution that assists in adding protective layers and electronic connections to the substrate before dicing. It also aids in reducing the chip size, streamlining the process of manufacturing, and testing the functionality of the chip. Besides this, it minimizes the cost of electrical testing, manages the inventory and enhances the overall performance. As a result, WLP is extensively utilized in devices, such as pressure sensors and microphones, across the globe.
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Market Trends and Drivers:
The thriving electronics industry, in confluence with significant investments in the infrastructure, represents one of the key factors driving the market. WLPs provide enhanced mechanical protection, structural support, and extended battery life to the devices. As a result, the demand for these cost-effective and high-performance packaging solutions is escalating around the world. Furthermore, leading manufacturers are incorporating connected devices with advanced technological solutions, such as the Internet of Things (IoT), which is creating a favorable market outlook. Consequently, WLP is employed in the production of self-driving automobiles and numerous wearable devices worldwide. Besides this, there is a considerable increase in the demand for portable consumer electronic devices. This, along with the growing circuit miniaturization in microelectronic devices, and the rising need for compact and faster consumer electronics, is anticipated to positively influence the market.
Note: We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.
Global Wafer Level Packaging Market 2022-2027 Analysis and Segmentation:
The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.
Amkor Technology, Inc. (AMKR), CHINA WAFER LEVEL CSP CO LTD (603005.SS), Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited (FJTSY), IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.
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The report has segmented the market on the basis of Packaging Technology, End User and Region.
Breakup by Packaging Technology:
3D TSV WLP
2.5D TSV WLP
Breakup by End Use Industry:
Aerospace and Defense
IT & Telecommunication
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